6GHz-8GHz High Efficiency 500W C-band Solid-State Power Amplifier for Radar System

The 6GHz-8GHz High Efficiency 500W C-band Solid-State Power Amplifier (SSPA) is a state-of-the-art solution designed to meet the demanding requirements of modern radar systems. Operating within the C-band frequency range of 6-8GHz, this amplifier delivers exceptional performance, combining high power output, robust efficiency, and advanced thermal management to ensure reliability in critical applications.

Product Detail

The 6GHz-8GHz High Efficiency 500W C-band Solid-State Power Amplifier sets a new benchmark in radar technology, delivering unmatched power density, adaptability, and reliability.

Key Features and Performance Highlights：
High Power Output and Efficiency: The amplifier achieves an impressive output power of ≥57dBm (500W) with a power gain of ≥50dB at 25°C, ensuring high efficiency in power conversion. This capability makes it ideal for radar systems requiring consistent and stable signal amplification across extended operational periods.

Wideband C-band Operation:
The amplifier supports radar systems operating in the 7.02–7.38GHz sub-band. Its solid-state design ensures low noise, high linearity, and minimal signal distortion.

Pulsed Operation Flexibility:
Designed for pulse-modulated radar systems, the amplifier enables seamless integration into diverse radar configurations, including phased-array and synthetic aperture radar (SAR) systems.

Technical Parameter Requirements	Working Frequency	7020～7380MHz
	Power Gain	≥50dB（25℃ Test）
	Output Power	≥57dBm（25℃ Test）
	Pulse	Duty cycle 20%; Pulse width 200us; The pulse format can be changed via the host computer.
	Function	RS422 serial communication, the module has power detection, temperature detection, current detection, open circuit protection
	Power Supply	DC+40V
	Interface	4 in total, 2 RF interfaces (internal DC isolation), 2 power interfaces and controls
Shape and Appearance Requirements	Dimensions: 200mm×150mm×25mm, bottom surface (heat dissipation surface) roughness less than 3.2mm, mounting surface flatness less than 0.15mm.
	The module should be assembled on a cold plate for use, with good heat dissipation; Its bottom surface is the surface for heat conduction.
Labeling Requirements	Methods of Labeling	Laser Inscription
Environmental Temperatures	Storage Temperature	-20～+60℃
	Operation Temperature	Low Temperature：－10℃±2℃； High Temperature：＋50℃±2℃
Other Requirements	The movable part of the product should be fixed before packaging.
	The product should be packed in a box with anti-vibration capability.
	The product is generally transported by road or rail; The storage temperature of the product during transportation should be between from -20 ℃ to +60 ℃; The relative humidity during transportation should not be more than 90%; The product shall withstand short-term storage in this environment.
	Packaged product should be stored in the indoor where the temperature is during the range from -20℃ to +60 ℃ and the relative humidity should not be more than 80%, without corrosive, flammable or explosive substances in the surrounding air.