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High Power 500W 6GHz-8GHz C-band power amplifier module for satellite communications
RF Module

High Power 500W 6GHz-8GHz C-band power amplifier module for satellite communications

This high-performance 500W 6-8GHz C-band power amplifier delivers ≥57dBm output power and ≥50dB gain (25°C). Supports 20% duty cycle pulses (200μs), configurable via host software. Ideal for radar, satellite communications, and electronic warfare in defense, aerospace, and telecom systems.

    This 500W high-power C-band (6GHz-8GHz) solid-state power amplifier module delivers exceptional performance for critical satellite communication systems. Designed specifically for high-throughput space-ground links and payload amplification, it combines military-grade reliability with telecom infrastructure requirements.

     

    Safety & Design:To ensure operational stability and reliability, the product incorporates multiple safety mechanisms. Utilizing the RSA22 serial communication protocol, it continuously monitors power status, temperature, and current parameters, while featuring open-circuit protection to prevent hardware damage from overloads or anomalies.

    Environmental Specs:The amplifier exhibits robust environmental resilience, capable of withstanding extreme climatic conditions.

    Applications:Enhances radar, satellite links, and electronic countermeasures. Modular design integrates into airborne, mobile, or fixed systems. Rugged for extreme defense/telecom environments.

     

    Technical Parameter Requirements

    Working Frequency

    6000~8000MHz

    Modulation System

    ASK,BPSK

    Output Power

    ≥15dBm(25℃ Test)

    Function

    RS422 serial communication, with current detection and open circuit protection

    Power Supply

    DC+40V

    Interface

    A total of 3 locations, 1 RF interface (internal DC isolation), 2 power interfaces and control locations

    Shape and Appearance Requirements

    Dimensions: 120mm×100mm×25mm, bottom surface (heat dissipation surface) roughness less than 3.2mm, mounting surface flatness less than 0.15mm.

    Labeling Requirements

    Methods of Labeling

    Laser Inscription

    Environmental requirements

    Storage Temperature

    -20~+60℃

    Operation Temperature

    Low Temperature:-10℃±2℃;
    High Temperature:+50℃±2℃

    Other Requirements

    1. The movable part of the product should be fixed before packaging.

    2. The product should be packed in a box with anti-vibration capability.

    3. The product is generally transported by road or rail; The storage temperature of the product during transportation should be between from -20 ℃ to +60 ℃; The relative humidity during transportation should not be more than 90%; The product shall withstand short-term storage in this environment.

    4. Packaged product should be stored in the indoor where the temperature is during the range from -20℃ to +60 ℃ and the relative humidity should not be more than 80%, without corrosive, flammable or explosive substances in the surrounding air.

     

    Technical Parameter Requirements

    Working Frequency

    7020~7380MHz

    Power Gain

    ≥50dB(25℃ Test)

    Output Power

    ≥57dBm(25℃ Test)

    Pulse

    Duty cycle 20%; Pulse width 200us; The pulse format can be changed via the host computer.

    Function

    RS422 serial communication, the module has power detection, temperature detection, current detection, open circuit protection

    Power Supply

    DC+40V

    Interface

    4 in total, 2 RF interfaces (internal DC isolation), 2 power interfaces and controls

    Shape and Appearance Requirements

    Dimensions: 200mm×150mm×25mm, bottom surface (heat dissipation surface) roughness less than 3.2mm, mounting surface flatness less than 0.15mm.

    The module should be assembled on a cold plate for use, with good heat dissipation; Its bottom surface is the surface for heat conduction.

    Labeling Requirements

    Methods of Labeling

    Laser Inscription

    Environmental Temperatures

    Storage Temperature

    -20~+60℃

    Operation Temperature

    Low Temperature:-10℃±2℃;
    High Temperature:+50℃±2℃

    Other Requirements

    1. The movable part of the product should be fixed before packaging.

    2. The product should be packed in a box with anti-vibration capability.

    3. The product is generally transported by road or rail; The storage temperature of the product during transportation should be between from -20 ℃ to +60 ℃; The relative humidity during transportation should not be more than 90%; The product shall withstand short-term storage in this environment.

    4. Packaged product should be stored in the indoor where the temperature is during the range from -20℃ to +60 ℃ and the relative humidity should not be more than 80%, without corrosive, flammable or explosive substances in the surrounding air.

     

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